Thermal stress and strain in microelectronics packaging

Sonraí bibleagrafaíochta
Rannpháirtithe:	Lau, John H.
Formáid:	LEABHAR
Teanga:	Béarla
Foilsithe / Cruthaithe:	New York Van Nostrand Reinhold c1993.
Ábhair:	Electronic packaging. Microelectronic packaging. Thermal stresses.