Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly
| Príomhchruthaitheoir: | |
|---|---|
| Formáid: | LEABHAR |
| Teanga: | English |
| Foilsithe / Cruthaithe: |
[S.l.]
Van Nostrand Reinhold
c1989, c1992.
|
| Ábhair: |