Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish
Sn-4%Ag-0.5%Cu (SAC405) alloy solder on Ni/Au surface finish is a standard solder joint material set for lead free solution. However, this technology solder/surface finish combination is marginal to drop performance requirements for hand-held device customers. An alternative solder alloy/substrate f...
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| Aineistotyyppi: | Opinnäyte |
| Kieli: | English |
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2007.
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