Parametric study of adhesive joints by using the probabilistic finite element approach
The thermal stresses in adhesive joints due to the large difference in thermal expansion between dissimilar materials presenting in adhesive electronic packages is the source of a major problem to be solved in order to achieve improved reliability. However, because of the shortage of the facilitated...
| Tác giả chính: | |
|---|---|
| Định dạng: | Luận văn |
| Ngôn ngữ: | English |
| Được phát hành: |
2006.
|
| Những chủ đề: |