Metal-polymer adhesion in plasma treated printed circuit boards
This research aims to investigate the adhesion strength between the sputter deposited metal and the polymer based substrates, as a function of the type of metal deposited, substrates? surface conditions prior to deposition, chemical composition profiles across the bond region and the mechanical prop...
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| Tác giả chính: |
Laniog, Bryant N |
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| Resource Type: | Luận văn
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| Ngôn ngữ: | English |
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| Được phát hành: |
2006.
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| Những chủ đề: |
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