Metal-polymer adhesion in plasma treated printed circuit boards
This research aims to investigate the adhesion strength between the sputter deposited metal and the polymer based substrates, as a function of the type of metal deposited, substrates? surface conditions prior to deposition, chemical composition profiles across the bond region and the mechanical prop...
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Bibliographic Details
Main Author: |
Laniog, Bryant N |
Resource Type: | Thesis
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Language: | English |
Published: |
2006.
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Subjects: |
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