Metal-polymer adhesion in plasma treated printed circuit boards
This research aims to investigate the adhesion strength between the sputter deposited metal and the polymer based substrates, as a function of the type of metal deposited, substrates? surface conditions prior to deposition, chemical composition profiles across the bond region and the mechanical prop...
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2006.
|
| Subjects: |