Finite element analysis of the deformation behavior of a thin flexible substrate due to thermal loading
The use of thin flexible substrates to maximize production capacity in high interconnect applications has posed many challenges in its assembly process. Gross deformations have been observed in most assembly processes that subject the substrate to drastic temperature changes translating to thermomec...
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| フォーマット: | 学位論文 |
| 言語: | English |
| 出版事項: |
2006
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