Warpage characterization for silicon-based integrated circuits
The mobile communication industry has driven the semiconductor industry to thinner, lighter, and cheaper devices, resulting to higher density integrated circuits in the recent years. The challenge to make an overall package thickness of as low as 1 mm is now driving the stacking technology. Another...
| Autor Principal: | |
|---|---|
| Formato: | Thesis |
| Idioma: | English |
| Publicado: |
2004.
|
| Subjects: |