Semiconductor advanced packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | Electronic Resource |
| اللغة: | English |
| منشور في: |
Singapore
Springer
[2021]
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-981-16-1376-0 https://doi.org/10.1007/978-981-16-1376-0 |