Semiconductor advanced packaging

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...

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Bibliographic Details

Main Author:	Lau, John H. (Author)
Format:	Electronic Resource
Language:	English
Published:	Singapore Springer [2021]
Subjects:	Semiconductors > Design and construction. Electronic books.
Online Access:	https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-981-16-1376-0 https://doi.org/10.1007/978-981-16-1376-0