Semiconductor advanced packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...
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| Médium: | Electronic Resource |
| Jazyk: | English |
| Vydáno: |
Singapore
Springer
[2021]
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| On-line přístup: | https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-981-16-1376-0 https://doi.org/10.1007/978-981-16-1376-0 |