Semiconductor advanced packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...
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| Định dạng: | Electronic Resource |
| Ngôn ngữ: | English |
| Được phát hành: |
Singapore
Springer
[2021]
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| Những chủ đề: | |
| Truy cập trực tuyến: | https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-981-16-1376-0 https://doi.org/10.1007/978-981-16-1376-0 |