Semiconductor advanced packaging

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...

詳細記述

書誌詳細

第一著者:	Lau, John H. (著者)
フォーマット:	Electronic Resource
言語:	English
出版事項:	Singapore Springer [2021]
主題:	Semiconductors > Design and construction. Electronic books.
オンライン･アクセス:	https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-981-16-1376-0 https://doi.org/10.1007/978-981-16-1376-0