APA (7th ed.) Citation

Lau, J. H. (2021). Semiconductor advanced packaging. Springer. https://doi.org/10.1007/978-981-16-1376-0

Chicago Style (17th ed.) Citation

Lau, John H. Semiconductor Advanced Packaging. Singapore: Springer, 2021. https://doi.org/10.1007/978-981-16-1376-0.

MLA (9th ed.) Citation

Lau, John H. Semiconductor Advanced Packaging. Springer, 2021. https://doi.org/10.1007/978-981-16-1376-0.