3D microelectronic packaging from architectures to applications

Bibliographische Detailangaben
Weitere Verfasser:	Li, Yan (HerausgeberIn), Goyal, Deepak (HerausgeberIn)
Format:	Electronic Resource
Sprache:	Englisch
Veröffentlicht:	Singapore Springer [2021]
Schlagworte:	Biotechnology. Electronics. Electronics > Materials. Microelectronics. Microelectronics > Packaging. Nanotechnology. Electronic circuits. Optical materials. Electronic books.
Online-Zugang:	Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy Available for University of the Philippines System via SpringerLink. Click here to access