3D microelectronic packaging from architectures to applications

Detalhes bibliográficos
Outros Autores:	Li, Yan (Editor), Goyal, Deepak (Editor)
Formato:	Electronic Resource
Idioma:	English
Publicado em:	Singapore Springer [2021]
Assuntos:	Biotechnology. Electronics. Electronics > Materials. Microelectronics. Microelectronics > Packaging. Nanotechnology. Electronic circuits. Optical materials. Electronic books.
Acesso em linha:	Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy Available for University of the Philippines System via SpringerLink. Click here to access