3D microelectronic packaging from architectures to applications

Detalles Bibliográficos
Otros Autores:	Li, Yan (Editor), Goyal, Deepak (Editor)
Formato:	Electronic Resource
Lenguaje:	English
Publicado:	Singapore Springer [2021]
Materias:	Biotechnology. Electronics. Electronics > Materials. Microelectronics. Microelectronics > Packaging. Nanotechnology. Electronic circuits. Optical materials. Electronic books.
Acceso en línea:	Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy Available for University of the Philippines System via SpringerLink. Click here to access