3D microelectronic packaging from architectures to applications

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς:	Li, Yan (Επιμελητής έκδοσης), Goyal, Deepak (Επιμελητής έκδοσης)
Μορφή:	Electronic Resource
Γλώσσα:	English
Έκδοση:	Singapore Springer [2021]
Θέματα:	Biotechnology. Electronics. Electronics > Materials. Microelectronics. Microelectronics > Packaging. Nanotechnology. Electronic circuits. Optical materials. Electronic books.
Διαθέσιμο Online:	Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy Available for University of the Philippines System via SpringerLink. Click here to access