APA引文

Li, Y., & Goyal, D. (2021). 3D microelectronic packaging: From architectures to applications. Springer. https://doi.org/10.1007/978-981-15-7090-2

Chicago Style (17th ed.) Citation

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Singapore: Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.

MLA引文

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.