Cita APA (7th ed.)

Li, Y., & Goyal, D. (2021). 3D microelectronic packaging: From architectures to applications. Springer. https://doi.org/10.1007/978-981-15-7090-2

Cita Chicago (17th ed.)

Li, Yan, i Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Singapore: Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.

Cita MLA (9th ed.)

Li, Yan, i Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.