Dyfyniad APA

Li, Y., & Goyal, D. (2021). 3D microelectronic packaging: From architectures to applications. Springer. https://doi.org/10.1007/978-981-15-7090-2

Dyfyniad Arddull Chicago

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Singapore: Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.

Dyfyniad MLA

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging: From Architectures to Applications. Springer, 2021. https://doi.org/10.1007/978-981-15-7090-2.

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