Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Dades bibliogràfiques
Autor principal: Yeh, L.T (Autor)
Format: Electronic Resource
Idioma:English
Publicat: New York, N.Y. The American Society of Mechanical Engineers [2019]
Matèries:
Electronic apparatus and appliances > Cooling.
Electronic books.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics).
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