Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Dettagli Bibliografici
Autore principale:	Yeh, L.T (Autore)
Natura:	Electronic Resource
Lingua:	English
Pubblicazione:	New York, N.Y. The American Society of Mechanical Engineers [2019]
Soggetti:	Electronic apparatus and appliances > Cooling. Electronic books. Electronic apparatus and appliances > Thermal properties. Microelectronics > Equipment and supplies. Cold plates (Electronics).
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