Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Opis bibliograficzny
1. autor: Yeh, L.T (Autor)
Format: Electronic Resource
Język:English
Wydane: New York, N.Y. The American Society of Mechanical Engineers [2019]
Hasła przedmiotowe:
Electronic apparatus and appliances > Cooling.
Electronic books.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics).
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