Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Bibliographische Detailangaben
1. Verfasser: Yeh, L.T (VerfasserIn)
Format: Electronic Resource
Sprache:English
Veröffentlicht: New York, N.Y. The American Society of Mechanical Engineers [2019]
Schlagworte:
Electronic apparatus and appliances > Cooling.
Electronic books.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics).
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