Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

التفاصيل البيبلوغرافية
المؤلف الرئيسي: Yeh, L.T (مؤلف)
التنسيق: Electronic Resource
اللغة:English
منشور في: New York, N.Y. The American Society of Mechanical Engineers [2019]
الموضوعات:
Electronic apparatus and appliances > Cooling.
Electronic books.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics).
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