Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Podrobná bibliografie
Hlavní autor: Yeh, L.T (Autor)
Médium: Electronic Resource
Jazyk:English
Vydáno: New York, N.Y. The American Society of Mechanical Engineers [2019]
Témata:
Electronic apparatus and appliances > Cooling.
Electronic books.
Electronic apparatus and appliances > Thermal properties.
Microelectronics > Equipment and supplies.
Cold plates (Electronics).
On-line přístup:Click here to access thru EZproxy
Click here to access