APA (7th ed.) Citation

De Guzman, J. C., Epistola, E., & Mena, M. (1997). Elimination of assembly-induces package cracks in plastic SOIC. Philippine Engineering Journal.

Chicago Style (17th ed.) Citation

De Guzman, Jose Cesar, Elmer Epistola, and Manolo Mena. "Elimination of Assembly-induces Package Cracks in Plastic SOIC." Philippine Engineering Journal 1997.

MLA (9th ed.) Citation

De Guzman, Jose Cesar, et al. "Elimination of Assembly-induces Package Cracks in Plastic SOIC." Philippine Engineering Journal, 1997.