Elimination of assembly-induces package cracks in plastic SOIC
| Foilsithe in: | Philippine Engineering Journal Vol. 18, no. 1 (1997), 37-66 |
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| Príomhchruthaitheoir: | |
| Rannpháirtithe: | , |
| Formáid: | Alt |
| Teanga: | English |
| Foilsithe / Cruthaithe: |
1997
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| Ábhair: |