Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages
| Cyhoeddwyd yn: | Philippine Engineering Journal Vol. 30, no. 2 (Dec. 2009), 13-20 |
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| Prif Awdur: | |
| Awduron Eraill: | |
| Fformat: | Erthygl |
| Iaith: | English |
| Cyhoeddwyd: |
2009
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| Pynciau: |