Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages
| Publicado no: | Philippine Engineering Journal Vol. 30, no. 2 (Dec. 2009), 13-20 |
|---|---|
| Autor principal: | |
| Outros Autores: | |
| Formato: | Artigo |
| Idioma: | English |
| Publicado em: |
2009
|
| Assuntos: |