Investigation of silicon die crack for varying silicon die parameters and die attach material
| Publicado en: | Philippine Engineering Journal Vol. 41, no. 1 (2020), 33-48 |
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| Autor Principal: | |
| Outros autores: | , , |
| Formato: | Artigo |
| Idioma: | English |
| Publicado: |
2020
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| Subjects: |