Citazione Stile APA (7a Edizione)

Macaspac, H. E., Callanga, J. F., Dimagiba, R. R., & Mena, M. (2020). Investigation of silicon die crack for varying silicon die parameters and die attach material. Philippine Engineering Journal.

Citazione stile Chigago Style (17a edizione)

Macaspac, Hannah Erika, Jennifer F. Callanga, Richard Raymond Dimagiba, e Manolo Mena. "Investigation of Silicon Die Crack for Varying Silicon Die Parameters and Die Attach Material." Philippine Engineering Journal 2020.

Citatione MLA (9a ed.)

Macaspac, Hannah Erika, et al. "Investigation of Silicon Die Crack for Varying Silicon Die Parameters and Die Attach Material." Philippine Engineering Journal, 2020.