APA (7th ed.) Citation

Macaspac, H. E., Callanga, J. F., Dimagiba, R. R., & Mena, M. (2020). Investigation of silicon die crack for varying silicon die parameters and die attach material. Philippine Engineering Journal.

Chicago Style (17th ed.) Citation

Macaspac, Hannah Erika, Jennifer F. Callanga, Richard Raymond Dimagiba, and Manolo Mena. "Investigation of Silicon Die Crack for Varying Silicon Die Parameters and Die Attach Material." Philippine Engineering Journal 2020.

MLA (9th ed.) Citation

Macaspac, Hannah Erika, et al. "Investigation of Silicon Die Crack for Varying Silicon Die Parameters and Die Attach Material." Philippine Engineering Journal, 2020.