Torthaí cuardaigh - "Wafer scale integration."

Ultra-thin chip technology and applications

Available for the University of the Philippines Diliman via SpringerLink. Click here to access

Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps de réir Amistoso, Jose Omar S.

Handbook of quality integrated circuit manufacturing de réir Zorich, Robert

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Manufacturing yield evaluation of VLSI/WSI systems

Efficient reconfigurable techniques for VLSI arrays with 6-port switches. de réir Wu Jigang

Pulsed wave interconnect. de réir Pingshan Wang