3D IC integration and packaging Bằng Lau, John H.

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3D stacked chips from emerging processes to heterogeneous systems

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Design of 3D integrated circuits and systems

Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access
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Arbitrary modeling of TSVs for 3D integrated circuits Bằng Salah, Khaled, Ismail, Yehea I. 1971-, El-Rouby, Alaa

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Through-silicon vias for 3D integration Bằng Lau, John H.

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Three-dimensional integrated circuit design Bằng Pavlidis, Vasilis F. 1976-

Calibration of Rent's rule models for three-dimensional integrated circuits. Bằng Das, S.