-
291
-
292
-
293
-
294
-
295
Elimination of assembly-induces package cracks in plastic SOIC
Published in Philippine Engineering Journal (1997)Article -
296
-
297
Thermal management in electronic packages
Published in Philippine Engineering Journal (1997)Article -
298
-
299
Styrofoam, plastic food packages to be phased out
Published in Philippine Daily Inquirer (1997)Article -
300


