Materials for advanced packaging

Available for University of the Philippines System via SpringerLink. Click here to access
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Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits ανά Gustilo, Paul Angelo D.

Advanced materials for thermal management of electronic packaging ανά Tong, Xingcun Colin

Available for University of the Philippines Diliman via SpringerLink. Click here to access

A business plan of Kalakalang kape Kobing Company for micro scale production of civet coffee green beans ανά Catingub, Wilson Bustamante, Jr

Plastics for electronics materials, properties, and design applications ανά Alvino, William M.

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Materials for electronic packaging

Microelectronics technology polymers for advanced imaging and packaging

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Selected ASTM standards on packaging

Soldering processes and equipment