Characterization of integrated circuit packaging materials

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Characterization of integrated circuit packaging materials

Polymeric materials for electronics packaging and interconnection

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Packaging materials monitoring system Vegoil Phils., Inc. by Arico, Ruby M.

Cross-sectional study of Filipino consumer perception, attitude, and purchasing patterns across different age groups regarding food packaging material by Castaneda, Carlos Joaquin R.

Available for University of the Philippines Diliman via Digital Archives. Click here to access.

Formulation and psysicochemical characterization of starch-based films for potential packaging applications by Gilongos, Pauline Ysabelle A., Marero, Emylle Dawn B., Villamora, Maria Angela M.

Development of fish gelatin-mango (Mangifera indica L.) peel pectin composite packaging film incorporated with virgin coconut oil by Vergara, Aeriel Venice A.

Available for University of the Philippines Diliman via Digital Archives. Click here to access.