Canlyniadau Chwilio - "Packaging Materials."

Materials for electronic packaging

Materials for advanced packaging

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Plastics for electronics materials, properties, and design applications gan Alvino, William M.

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Characterization of integrated circuit packaging materials

Polymeric materials for electronics packaging and interconnection

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Packaging materials monitoring system Vegoil Phils., Inc. gan Arico, Ruby M.

Soldering processes and equipment

Characterization of integrated circuit packaging materials

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Microelectronics technology polymers for advanced imaging and packaging

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy