Packaging.

Migration from food contact materials

Plastics for electronics materials, properties, and design applications por Alvino, William M.

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Materials for electronic packaging

The North American corporate design review the annual of corporate design excellence.

Active food packaging

Encapsulation and controlled release of food ingredients

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Microelectronics technology polymers for advanced imaging and packaging

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Pharmaceutical marketing in the Philippine setting por Lao, Felix M.