Suchergebnisse - "Microelectronics."

Treffer weiter einschränken
  1. 71

    Investigation of silicon die crack for varying silicon die parameters and die attach material von Macaspac, Hannah Erika

    Veröffentlicht in Philippine Engineering Journal (2020)
    Artikel


    Buchumschlag
  2. 72

    IMI celebrates 25 years, goes global

    Veröffentlicht in Philippine Star (2005)
    Artikel


    Buchumschlag
  3. 73

    3D microelectronic packaging from architectures to applications

    Veröffentlicht 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource


    Buchumschlag
  4. 74

    Design and test strategies for 2D/3D integration for noc-based multicore architectures von Manna, Kanchan, Mathew, Jimson

    Veröffentlicht 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag
  5. 75

    Handbook of digital CMOS technology, circuits, and systems von Abbas, Karim

    Veröffentlicht 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag
  6. 76

    System-on-Chip security validation and verification von Farahmandi, Farimah, Huang, Yuanwen, Mishra, Prabhat

    Veröffentlicht 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag
  7. 77

    Electronic experiences in a virtual lab von Gastaldi, Roberto, Campardo, Giovanni

    Veröffentlicht 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag
  8. 78

    Atomic layer deposition principles, characteristics, and nanotechnology applications

    Buch


    Buchumschlag
  9. 79

    Assembly and reliability of lead-free solder joints von Lau, John H., Lee, Ning-Cheng

    Veröffentlicht 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag
  10. 80

    Automated broad and narrow band impedance matching for RF and microwave circuits von Banerjee, Amal

    Veröffentlicht 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Buchumschlag

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