Search Results - "Microelectronics."

Refine Results
  1. 71

    Investigation of silicon die crack for varying silicon die parameters and die attach material by Macaspac, Hannah Erika

    Published in Philippine Engineering Journal (2020)
    Article


    Cover Image
  2. 72

    IMI celebrates 25 years, goes global

    Published in Philippine Star (2005)
    Article


    Cover Image
  3. 73

    3D microelectronic packaging from architectures to applications

    Published 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource


    Cover Image
  4. 74

    Design and test strategies for 2D/3D integration for noc-based multicore architectures by Manna, Kanchan, Mathew, Jimson

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  5. 75

    Handbook of digital CMOS technology, circuits, and systems by Abbas, Karim

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  6. 76

    System-on-Chip security validation and verification by Farahmandi, Farimah, Huang, Yuanwen, Mishra, Prabhat

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  7. 77

    Electronic experiences in a virtual lab by Gastaldi, Roberto, Campardo, Giovanni

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  8. 78

    Atomic layer deposition principles, characteristics, and nanotechnology applications

    Book


    Cover Image
  9. 79

    Assembly and reliability of lead-free solder joints by Lau, John H., Lee, Ning-Cheng

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  10. 80

    Automated broad and narrow band impedance matching for RF and microwave circuits by Banerjee, Amal

    Published 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Cover Image

Search Tools: