Ngā hua rapu - "Microelectronics Packaging."

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Thermal stress and strain in microelectronics packaging

Chip scale package (CSP) design, materials, processes, reliability, and applications mā Lau, John H.

MEMS packaging

Available for University of the Philippines Diliman via World Scientific. Click here to access
Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy

3D microelectronic packaging from architectures to applications

Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Available for University of the Philippines System via SpringerLink. Click here to access

Introduction to system-on-package (SOP) miniaturization of the entire system mā Tummala, Rao R. 1942-

Table of contents only

Area array packaging handbook manufacturing and assembly mā Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

MEMS/MOEMS packaging concepts, designs, materials, and processes mā Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access

3D IC integration and packaging mā Lau, John H.

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy