Rezultaty 1 - 10 Rezultaty od 30 Dla wyszukiwania '"Microelectronic packaging."', Czas wyszukiwania: 0,02s Redukuj rezultaty
  1. 1

    3D microelectronic packaging from architectures to applications

    Wydane 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource

    3D microelectronic packaging from architectures to applications
  2. 2

    Fundamentals of device and systems packaging technologies and applications

    Wydane 2019
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of device and systems packaging technologies and applications
  3. 3

    MEMS packaging

    Wydane 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  4. 4

    RF and microwave microelectronics packaging II

    Wydane 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    RF and microwave microelectronics packaging II
  5. 5

    3D microelectronic packaging from fundamentals to applications

    Wydane 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    3D microelectronic packaging from fundamentals to applications
  6. 6

    3D IC integration and packaging od Lau, John H.

    Wydane 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  7. 7

    Advanced MEMS packaging

    Wydane 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Książka

    Advanced MEMS packaging
  8. 8

    Advanced MEMS packaging

    Wydane 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  9. 9

    System-on-package (SOP) miniaturization of the entire system od Tummala, Rao R. 1942-

    Wydane 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    System-on-package (SOP) miniaturization of the entire system
  10. 10

    Introduction to system-on-package (SOP) miniaturization of the entire system od Tummala, Rao R. 1942-

    Wydane 2008
    Table of contents only
    Książka

    Introduction to system-on-package (SOP) miniaturization of the entire system

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