Εμφανίζονται 1 - 10 Αποτελέσματα από 30 για την αναζήτηση '"Microelectronic packaging."', χρόνος αναζήτησης: 0,02δλ Περιορισμός αποτελεσμάτων
  1. 1

    3D microelectronic packaging from architectures to applications

    Έκδοση 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource

    3D microelectronic packaging from architectures to applications
  2. 2

    Fundamentals of device and systems packaging technologies and applications

    Έκδοση 2019
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of device and systems packaging technologies and applications
  3. 3

    MEMS packaging

    Έκδοση 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  4. 4

    RF and microwave microelectronics packaging II

    Έκδοση 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    RF and microwave microelectronics packaging II
  5. 5

    3D microelectronic packaging from fundamentals to applications

    Έκδοση 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    3D microelectronic packaging from fundamentals to applications
  6. 6

    3D IC integration and packaging ανά Lau, John H.

    Έκδοση 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  7. 7

    Advanced MEMS packaging

    Έκδοση 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Βιβλίο

    Advanced MEMS packaging
  8. 8

    Advanced MEMS packaging

    Έκδοση 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  9. 9

    System-on-package (SOP) miniaturization of the entire system ανά Tummala, Rao R. 1942-

    Έκδοση 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    System-on-package (SOP) miniaturization of the entire system
  10. 10

    Introduction to system-on-package (SOP) miniaturization of the entire system ανά Tummala, Rao R. 1942-

    Έκδοση 2008
    Table of contents only
    Βιβλίο

    Introduction to system-on-package (SOP) miniaturization of the entire system

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