खोज परिणाम - "Microelectronic packaging."

परिणाम को परिष्कृत करें
  1. 21

    Quantum-well laser array packaging nanoscale packaging techniques

    प्रकाशित 2007
    पुस्तक


    कवर छवि
  2. 22

    Quantum-well laser array packaging nanoscale packaging techniques

    प्रकाशित 2007
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Electronic Resource


    कवर छवि
  3. 23

    Multichip module technology handbook द्वारा Garrou, Philip E.

    प्रकाशित 1998
    पुस्तक


    कवर छवि
  4. 24

    3D microelectronic packaging from fundamentals to applications

    प्रकाशित 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    कवर छवि
  5. 25

    Microvias for low-cost, high density interconnects द्वारा Lau, John H.

    प्रकाशित 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    कवर छवि
  6. 26

    Microelectronic system interconnections performance and modeling

    प्रकाशित 1994
    पुस्तक


    कवर छवि
  7. 27

    Flip chip technologies

    प्रकाशित 1996
    पुस्तक


    कवर छवि
  8. 28

    Fundamentals of microsystems packaging

    प्रकाशित 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    कवर छवि
  9. 29

    Microelectronic packaging for retinal prostheses. द्वारा Rodger, D.C

    में प्रकाशित IEEE Engineering in medicine and biology magazine
    लेख


    कवर छवि
  10. 30

    3D microelectronic packaging from architectures to applications

    प्रकाशित 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource


    कवर छवि

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