نتائج البحث - "Microelectronic packaging."

  1. 11

    Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

    منشور في 1995
    كتاب
  2. 12

    Thermal stress and strain in microelectronics packaging

    منشور في 1993
    كتاب
  3. 13

    Chip scale package (CSP) design, materials, processes, reliability, and applications حسب Lau, John H.

    منشور في 1999
    كتاب
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