Hakutulokset - "Microelectronic packaging."

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Thermal stress and strain in microelectronics packaging

Chip scale package (CSP) design, materials, processes, reliability, and applications Tekijä Lau, John H.

MEMS packaging

Available for University of the Philippines Diliman via World Scientific. Click here to access
Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy

Introduction to system-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

Table of contents only

Area array packaging handbook manufacturing and assembly Tekijä Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

MEMS/MOEMS packaging concepts, designs, materials, and processes Tekijä Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access

3D IC integration and packaging Tekijä Lau, John H.

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

System-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Microelectronics technology polymers for advanced imaging and packaging

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy