Search Results - "Microelectronic packaging."

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  1. 11

    Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

    Published 1995
    Book


    Cover Image
  2. 12

    Thermal stress and strain in microelectronics packaging

    Published 1993
    Book


    Cover Image
  3. 13

    Chip scale package (CSP) design, materials, processes, reliability, and applications by Lau, John H.

    Published 1999
    Book


    Cover Image
  4. 14

    MEMS packaging

    Published 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  5. 15

    Introduction to system-on-package (SOP) miniaturization of the entire system by Tummala, Rao R. 1942-

    Published 2008
    Table of contents only
    Book


    Cover Image
  6. 16

    Area array packaging handbook manufacturing and assembly by Gilleo, Ken

    Published 2002
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  7. 17

    MEMS/MOEMS packaging concepts, designs, materials, and processes by Gilleo, Ken

    Published 2005
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Electronic Resource


    Cover Image
  8. 18

    3D IC integration and packaging by Lau, John H.

    Published 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  9. 19

    System-on-package (SOP) miniaturization of the entire system by Tummala, Rao R. 1942-

    Published 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Cover Image
  10. 20

    Microelectronics technology polymers for advanced imaging and packaging

    Published 1995
    Available for University of the Philippines Diliman via ACS Publications. Click here to access
    Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
    Electronic Resource


    Cover Image

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