Kết quả tìm kiếm - "Microelectronic packaging."
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11
Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications
Được phát hành 1995Sách
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12
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Chip scale package (CSP) design, materials, processes, reliability, and applications
Được phát hành 1999Sách -
14
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15
Introduction to system-on-package (SOP) miniaturization of the entire system
Được phát hành 2008Table of contents only
Sách -
16
Area array packaging handbook manufacturing and assembly
Được phát hành 2002Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
17
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18
3D IC integration and packaging
Được phát hành 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
19
System-on-package (SOP) miniaturization of the entire system
Được phát hành 2008Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
20
Microelectronics technology polymers for advanced imaging and packaging
Được phát hành 1995Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
Electronic Resource