Showing 11 - 20 results of 30 for search '"Microelectronic packaging."', सवाल का समय: 0.02सेकंड परिणाम को परिष्कृत करें
  1. 11

    Quantum-well laser array packaging nanoscale packaging techniques

    प्रकाशित 2007
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy
    Electronic Resource

    Quantum-well laser array packaging nanoscale packaging techniques
  2. 12

    Quantum-well laser array packaging nanoscale packaging techniques

    प्रकाशित 2007
    पुस्तक

    Quantum-well laser array packaging nanoscale packaging techniques
  3. 13

    Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

    प्रकाशित 2005
    पुस्तक

    Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements
  4. 14

    MEMS/MOEMS packaging concepts, designs, materials, and processes द्वारा Gilleo, Ken

    प्रकाशित 2005
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy
    Electronic Resource

    MEMS/MOEMS packaging concepts, designs, materials, and processes
  5. 15

    MEMS packaging

    प्रकाशित 2004
    Available for University of the Philippines Diliman via IET Digital Library. Click here to access
    Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  6. 16

    MEMS & microsystems design and manufacture द्वारा Hsu, Tai-Ran

    प्रकाशित 2002
    पुस्तक

    MEMS & microsystems design and manufacture
  7. 17

    Area array packaging handbook manufacturing and assembly द्वारा Gilleo, Ken

    प्रकाशित 2002
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Area array packaging handbook manufacturing and assembly
  8. 18

    Fundamentals of microsystems packaging

    प्रकाशित 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of microsystems packaging
  9. 19

    Microvias for low-cost, high density interconnects द्वारा Lau, John H.

    प्रकाशित 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Microvias for low-cost, high density interconnects
  10. 20

    Chip scale package (CSP) design, materials, processes, reliability, and applications द्वारा Lau, John H.

    प्रकाशित 1999
    पुस्तक

    Chip scale package (CSP) design, materials, processes, reliability, and applications

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