Multichip module technology handbook od Garrou, Philip E.

Optoelectronic packaging

Microelectronics packaging handbook

Flip chip technologies

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Microelectronics technology polymers for advanced imaging and packaging

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Microelectronic system interconnections performance and modeling

Thermal stress and strain in microelectronics packaging

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Microelectronic packaging for retinal prostheses. od Rodger, D.C