תוצאות חיפוש - "Microelectronic packaging"
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3D microelectronic packaging from fundamentals to applications
יצא לאור 2017Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
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Microvias for low-cost, high density interconnects
יצא לאור 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Fundamentals of microsystems packaging
יצא לאור 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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3D microelectronic packaging from architectures to applications
יצא לאור 2021Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Available for University of the Philippines System via SpringerLink. Click here to access
Electronic Resource


