Toon 1 - 2 resultaten van 2 Voor zoekopdracht '"Intermetallic compounds Thermal properties."', zoektijd: 0,02s Verfijn jouw resultaten
  1. 1

    Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... door Manauis, Melissa B.

    Gepubliceerd in 2007
    Thesis

    Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish
  2. 2

    Rare earth intermetallics door Wallace, W. E. (William Edward) 1917-

    Gepubliceerd in 1973
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Rare earth intermetallics

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