Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... gan Manauis, Melissa B.

Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies gan Borlasa, Ma. Eleanor Oyam

Physical metallurgy and processing of intermetallic compounds

Intermetallic compounds principles and practice

Handbook of crystal structures and magnetic properties of rare earth intermetallics gan Szytula, Andrzej 1940-

Critical issues in the development of high temperature structural materials proceedings from the Conference on Critical Issues in the Development of High Temperature Structural Mat...

Rare earth intermetallics gan Wallace, W. E. (William Edward) 1917-

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The constitution of inorganic compounds atomic quantum mechanics: metals and intermetallic compounds gan Waugh, John L. T.

Evaluating the solderability of SN-AG-CU-Bi alloys

Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates gan Mechilina, Aurelia Celebre