Cosmopolitan commons sharing resources and risks across borders

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Through-silicon vias for 3D integration 著者: Lau, John H.

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Cosmopolitan commons sharing resources and risks across borders

Available for University of the Philippines Diliman via MIT Press Direct. Click here to access
Also available remotely for University of the Philippines Diliman via MIT Press Direct. Click here to access thru EZproxy

23rd European Symposium on Computer Aided Process Engineering

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Intelligent integrated systems devices, technologies, and architectures

Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access
Also available remotely for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access thru EZproxy

Digital design with an introduction to the Verilog HDL 著者: Mano, M. Morris 1927-, Ciletti, Michael D.

Analog circuit design.

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Facilities in UPIS only partially completed

Circuit design techniques for non-crystalline semiconductors 著者: Sambandan, Sanjiv

Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access
Also available remotely for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access thru EZproxy

Material strategies in digital fabrication 著者: Beorkrem, Christopher