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3D IC integration and packaging
Published 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
86
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3D stacked chips from emerging processes to heterogeneous systems
Published 2016Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
88
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CMOS indoor light energy harvesting system for wireless sensing applications
Published 2016Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
90


