Elimination of assembly induced package cracks in plastic SOIC by De Guzman, Jose Cesar

Also available online for University of the Philippines Diliman. Click here

Delamination in plastic packages by Mena, Manolo G.

Also available online for University of the Philippines Diliman. Click here

Nondestructive and subsurface defect detection in integrated circuits using advanced microscopy and spectroscopy techniques by Tarun, Alvarado B.

Automated design optimization of CMOS VLSI operational amplifiers by Mangaser, Ramon A.

IEEE journal of solid-state circuits.

Simulation of L-Topology matching networks for MMIC applications by Dizon, Jefferson C.

A self-calibrating Hall sensor IC with direction detection. by Draxelmayr, D.

SiGe W-CDMA transmitter for mobile terminal application. by Malhi, D.S

A 12-bit 75-MS by Murmann, B.

A CMOS multichannel 10-Gb by Takauchi, H.