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331
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332
-
333
Low dielectric constant materials for IC applications
Pubblicazione 2003Table of contents only
Libro -
334
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335
-
336
Analog VLSI circuits and principles
Pubblicazione 2002Click here to access thru EZproxy
Click here to access
Electronic Resource -
337
Silicon wafer bonding technology for VLSI and MEMS applications
Pubblicazione 2002Available for University of the Philippines Diliman via IET Digital Library. Click here to access
Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
Electronic Resource -
338
-
339
Analog circuit design scalable analog circuit design, high speed D/A converters, RF power amplifiers
Pubblicazione 2002Libro -
340


