Resultados da busca - "Integrated circuits Wafer-scale integration"

Ultra-thin chip technology and applications

Available for the University of the Philippines Diliman via SpringerLink. Click here to access

Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps por Amistoso, Jose Omar S.

Handbook of quality integrated circuit manufacturing por Zorich, Robert

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Manufacturing yield evaluation of VLSI/WSI systems