-
161
Simulation techniques and solutions for mixed-signal coupling in integrated circuits
Pubblicazione 1995Libro -
162
-
163
-
164
-
165
-
166
-
167
Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability
Pubblicazione 1994Libro -
168
-
169
-
170
Characterization of integrated circuit packaging materials
Pubblicazione 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource