Elimination of assembly induced package cracks in plastic SOIC von De Guzman, Jose Cesar

Also available online for University of the Philippines Diliman. Click here

Delamination in plastic packages von Mena, Manolo G.

Also available online for University of the Philippines Diliman. Click here

Nondestructive and subsurface defect detection in integrated circuits using advanced microscopy and spectroscopy techniques von Tarun, Alvarado B.

Automated design optimization of CMOS VLSI operational amplifiers von Mangaser, Ramon A.

IEEE journal of solid-state circuits.

Simulation of L-Topology matching networks for MMIC applications von Dizon, Jefferson C.

A self-calibrating Hall sensor IC with direction detection. von Draxelmayr, D.

SiGe W-CDMA transmitter for mobile terminal application. von Malhi, D.S

A 12-bit 75-MS von Murmann, B.

A CMOS multichannel 10-Gb von Takauchi, H.